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1
Joining Superconducting MgB2 Parts by Spark Plasma Sintering: A New Technique with High Potential for Manufacturing Future Superconducting Devices
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Joining Superconducting MgB2 Parts by Spark Plasma Sintering: A New Technique with High Potential for Manufacturing Future Superconducting Devices

Thimont, Yohann ; Xing, Yiteng ; Bernstein, Pierre ; Miryala, Muralidhar ; Noudem, Jacques

Coatings (Basel), 2022-08, Vol.12 (8), p.1151 [Periódico revisado por pares]

Basel: MDPI AG

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2
Bounds on the Superconducting Transition Temperature: Applications to Twisted Bilayer Graphene and Cold Atoms
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Bounds on the Superconducting Transition Temperature: Applications to Twisted Bilayer Graphene and Cold Atoms

Hazra, Tamaghna ; Verma, Nishchhal ; Randeria, Mohit

Physical review. X, 2019-09, Vol.9 (3), p.031049, Article 031049 [Periódico revisado por pares]

College Park: American Physical Society

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3
3-D Finite-Element Thin-Shell Model for High-Temperature Superconducting Tapes
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3-D Finite-Element Thin-Shell Model for High-Temperature Superconducting Tapes

Alves, Bruno de Sousa ; Laforest, Marc ; Sirois, Frederic

IEEE transactions on applied superconductivity, 2022-04, Vol.32 (3), p.1-11 [Periódico revisado por pares]

New York: IEEE

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4
The Quench Detection System Based on Programmable FPGA and Its Application at IMP
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The Quench Detection System Based on Programmable FPGA and Its Application at IMP

Ou, Xianjin ; Yang, Wenjie ; Wu, Wei ; Ni, Dongsheng ; Zheng, Shijun ; Mei, Enming ; Yang, Yanbing ; Wang, Xudng ; Yao, Qinggao ; Han, Shaofei

IEEE transactions on applied superconductivity, 2021-08, Vol.31 (5), p.1-5 [Periódico revisado por pares]

New York: IEEE

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5
High Field Superconducting Solenoids Via High Temperature Superconductors
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High Field Superconducting Solenoids Via High Temperature Superconductors

Schwartz, J. ; Effio, T. ; Xiaotao Liu ; Le, Q.V. ; Mbaruku, A.L. ; Schneider-Muntau, H.J. ; Tengming Shen ; Honghai Song ; Trociewitz, U.P. ; Xiaorong Wang ; Weijers, H.W.

IEEE transactions on applied superconductivity, 2008-06, Vol.18 (2), p.70-81 [Periódico revisado por pares]

New York, NY: IEEE

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6
High-Jc silver-sheathed Bi-based superconducting wires
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High-Jc silver-sheathed Bi-based superconducting wires

SATO, K ; HIKATA, T ; MUKAI, H ; UEYAMA, M ; SHIBUTA, N ; KATO, T ; MASUDA, T ; NAGATA, M ; IWATA, K ; MITSUI, T

IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1991, Vol.27 (2), p.1231-1238

New York, NY: Institute of Electrical and Electronics Engineers

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7
Numerical determination of hysteresis parameters for the modeling of magnetic properties using the theory of ferromagnetic hysteresis
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Numerical determination of hysteresis parameters for the modeling of magnetic properties using the theory of ferromagnetic hysteresis

Jiles, D.C. ; Thoelke, J.B. ; Devine, M.K.

IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1992-01, Vol.28 (1), p.27-35

NEW YORK: IEEE

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8
High Field Magnets With HTS Conductors
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High Field Magnets With HTS Conductors

Weijers, H W ; Trociewitz, U P ; Markiewicz, W D ; Jiang, J ; Myers, D ; Hellstrom, E E ; Xu, A ; Jaroszynski, J ; Noyes, P ; Viouchkov, Y ; Larbalestier, D C

IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.576-582 [Periódico revisado por pares]

New York, NY: IEEE

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9
Magnetospheric vortex formation: self-organized confinement of charged particles
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Magnetospheric vortex formation: self-organized confinement of charged particles

Yoshida, Z ; Saitoh, H ; Morikawa, J ; Yano, Y ; Watanabe, S ; Ogawa, Y

Physical review letters, 2010-06, Vol.104 (23), p.235004-235004, Article 235004 [Periódico revisado por pares]

United States

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10
The Design and Winding Method of a Conduction-Cooled 1.5 T Bi-2223 High Temperature Superconducting Magnet
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The Design and Winding Method of a Conduction-Cooled 1.5 T Bi-2223 High Temperature Superconducting Magnet

Ling, Jiayin ; Gu, Chen ; Qu, Timing ; Han, Zhenghe

IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.2002-2005 [Periódico revisado por pares]

New York, NY: IEEE

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