Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acidFujino, Masahisa ; Akaike, Masatake ; Matsuoka, Naoya ; Suga, TadatomoJapanese Journal of Applied Physics, 2017-04, Vol.56 (4S), p.4-04CC01 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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2 |
Material Type: Artigo
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Effect of Cu-Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumpsPark, Jong-Myeong ; Kim, Seung-Hyun ; Jeong, Myeong-Hyeok ; Park, Young-BaeJapanese Journal of Applied Physics, 2014-05, Vol.53 (5S3), p.5-1-05HA06-4 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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3 |
Material Type: Artigo
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Effect of deposition pressure on the properties of magnetron-sputter-deposited molybdenum back contacts for CIGS solar cellsLi, Weimin ; Yan, Xia ; Aberle, Armin G. ; Venkataraj, SelvarajJapanese Journal of Applied Physics, 2015-08, Vol.54 (8S1), p.8 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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4 |
Material Type: Artigo
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Copper film prepared from copper fine particle paste by laser sintering at room temperature: Influences of sintering atmosphere on the morphology and resistivityQin, Gang ; Watanabe, Akira ; Tsukamoto, Hiroki ; Yonezawa, TetsuJapanese Journal of Applied Physics, 2014, Vol.53 (9), p.96501-1-096501-9 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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5 |
Material Type: Artigo
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Threefold atmospheric-pressure annealing for suppressing graphene nucleation on copper in chemical vapor depositionSuzuki, Seiya ; Nagamori, Takashi ; Matsuoka, Yuki ; Yoshimura, MasamichiJapanese Journal of Applied Physics, 2014-09, Vol.53 (9), p.95101-1-095101-6 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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6 |
Material Type: Artigo
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All-copper contacting technology for film-vs-film electric connection using cool plasma sinteringShirakawa, NaokiJapanese Journal of Applied Physics, 2017-05, Vol.56 (5S2), p.05EB04-05EB04 [Periódico revisado por pares]Tokyo: The Japan Society of Applied PhysicsTexto completo disponível |
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7 |
Material Type: Artigo
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High-temperature thermoelectric properties and thermal stability in air of copper zinc tin sulfide for the p-type leg of thermoelectric devicesKosuga, Atsuko ; Matsuzawa, Mie ; Horie, Akito ; Omoto, Tatsuro ; Funahashi, RyojiJapanese Journal of Applied Physics, 2015-06, Vol.54 (6), p.61801 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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8 |
Material Type: Artigo
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Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formationCho, Byoung-Jun ; Kim, Jin-Yong ; Hamada, Satomi ; Shima, Shohei ; Park, Jin-GooJapanese Journal of Applied Physics, 2016-06, Vol.55 (6S3), p.6-06JB01 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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9 |
Material Type: Artigo
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Field dependent elastic anomaly in uniaxial tungsten bronze relaxorsAftabuzzaman, Md ; Dec, Jan ; Kleemann, Wolfgang ; Kojima, SeijiJapanese Journal of Applied Physics, 2016-10, Vol.55 (10S), p.10-10TC01 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |
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10 |
Material Type: Artigo
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Effects of work hardening rate on formation of nanocrystallized subsurface layer in Cu alloysSato, Hisashi ; Kaneko, Yuya ; Watanabe, YoshimiJapanese Journal of Applied Physics, 2017-01, Vol.56 (1S), p.1-01AE05 [Periódico revisado por pares]The Japan Society of Applied PhysicsTexto completo disponível |