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Refinado por: tipo de recurso: Standards remover
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CFD Investigation of a Mobula Birostris-Based Bionic Vortex Generator on Mitigating the Influence of Surface Roughness Sensitivity of a Wind Turbine Airfoil
CFD Investigation of a Mobula Birostris-Based Bionic Vortex Generator on Mitigating the Influence of Surface Roughness Sensitivity of a Wind Turbine Airfoil
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CFD Investigation of a Mobula Birostris-Based Bionic Vortex Generator on Mitigating the Influence of Surface Roughness Sensitivity of a Wind Turbine Airfoil

Zhang, Zhaohuang ; Li, Weiwei ; Jia, Xiaona

Access, IEEE, 2020, Vol.8, p.223889-223896

IEEE

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2
Systematic Errors Observed in CryoSat-2 Elevation Swaths on Mountain Glaciers and Their Implications
Systematic Errors Observed in CryoSat-2 Elevation Swaths on Mountain Glaciers and Their Implications
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Systematic Errors Observed in CryoSat-2 Elevation Swaths on Mountain Glaciers and Their Implications

Haacker, Jan ; Wouters, Bert ; Slobbe, Cornelis

Geoscience and Remote Sensing, IEEE Transactions on, 2023, Vol.61, p.1-12

IEEE

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3
On the Relationship Between Stickiness in DMRT Theory and Physical Parameters of Snowpack: Theoretical Formulation and Experimental Validation With SNOWPACK Snow Model and X-Band SAR Data
On the Relationship Between Stickiness in DMRT Theory and Physical Parameters of Snowpack: Theoretical Formulation and Experimental Validation With SNOWPACK Snow Model and X-Band SAR Data
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On the Relationship Between Stickiness in DMRT Theory and Physical Parameters of Snowpack: Theoretical Formulation and Experimental Validation With SNOWPACK Snow Model and X-Band SAR Data

Pilia, Simone ; Baroni, Fabrizio ; Lapini, Alessandro ; Paloscia, Simonetta ; Pettinato, Simone ; Santi, Emanuele ; Pampaloni, Paolo ; Valt, Mauro ; Monti, Fabiano

Geoscience and Remote Sensing, IEEE Transactions on, 2022, Vol.60, p.1-14

IEEE

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4
Transient Analysis of Hybrid Cu-CNT On-Chip Interconnects Using MRA Technique
Transient Analysis of Hybrid Cu-CNT On-Chip Interconnects Using MRA Technique
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Transient Analysis of Hybrid Cu-CNT On-Chip Interconnects Using MRA Technique

Kumar, Amit ; Kaushik, Brajesh

Nanotechnology, IEEE Open Journal of, 2022, Vol.3, p.24-35

IEEE

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