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Interparticle-Coupled Metasurface for Infrared Plasmonic Absorption
Interparticle-Coupled Metasurface for Infrared Plasmonic Absorption
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Interparticle-Coupled Metasurface for Infrared Plasmonic Absorption

Ullah, Zaka ; Nawi, Illani M ; Al-Hasan, Muath ; Junaid, Muhammad ; Mabrouk, Ismail Ben ; Rehman, Abdul

Access, IEEE, 2023, Vol.11, p.41546-41555

IEEE

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2
Enhanced Wide Spectrum Photocatalytic Activity by in-Situ Magnetite-Graphite Nanoplatelets Heterostructure
Enhanced Wide Spectrum Photocatalytic Activity by in-Situ Magnetite-Graphite Nanoplatelets Heterostructure
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Enhanced Wide Spectrum Photocatalytic Activity by in-Situ Magnetite-Graphite Nanoplatelets Heterostructure

Sameera, S. A. L ; Edirisinghe, N. P ; Kannangara, Yasun Y ; Karunarathne, Shadeepa ; Koswattage, K. R ; Perera, H. C. S ; Das, G ; Mantilaka, M. M. M. G. P. G ; Wijesinghe, W. P. S. L

Access, IEEE, 2023, Vol.11, p.68912-68924

IEEE

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3
Approaching PetaVolts per Meter Plasmonics Using Structured Semiconductors
Approaching PetaVolts per Meter Plasmonics Using Structured Semiconductors
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Approaching PetaVolts per Meter Plasmonics Using Structured Semiconductors

Sahai, Aakash Ajit ; Golkowski, Mark ; Katsouleas, Thomas ; Andonian, Gerard ; White, Glen ; Joshi, Chandrashekhar ; Taborek, Peter ; Harid, Vijay ; Stohr, Joachim

Access, IEEE, 2023, Vol.11, p.476-493

IEEE

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4
Foreword Special Issue on the 3rd Latin American Electron Device Conference
Foreword Special Issue on the 3rd Latin American Electron Device Conference
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Foreword Special Issue on the 3rd Latin American Electron Device Conference

Marsal, Lluis F ; Escobosa, Arturo ; Iniguez, Benjamin ; Guarin, Fernando

Electron Devices Society, IEEE Journal of the, 2022, Vol.10, p.413-415

IEEE

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5
Cryogenic Controller for Electrostatically Controlled Quantum Dots in 22-nm Quantum SoC
Cryogenic Controller for Electrostatically Controlled Quantum Dots in 22-nm Quantum SoC
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Cryogenic Controller for Electrostatically Controlled Quantum Dots in 22-nm Quantum SoC

Staszewski, Robert Bogdan ; Esmailiyan, Ali ; Wang, Hongying ; Koskin, Eugene ; Giounanlis, Panagiotis ; Wu, Xutong ; Koziol, Anna ; Sokolov, Andrii ; Bashir, Imran ; Asker, Mike ; Leipold, Dirk ; Nikandish, Reza ; Siriburanon, Teerachot ; Blokhina, Elena

Solid-State Circuits Society, IEEE Open Journal of the, 2022, Vol.2, p.103-121

IEEE

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6
A Sleeve-Based, Micromotion Avoiding, Retractable and Tear-Opening (SMART) Insertion Tool for Cochlear Implantation
A Sleeve-Based, Micromotion Avoiding, Retractable and Tear-Opening (SMART) Insertion Tool for Cochlear Implantation
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A Sleeve-Based, Micromotion Avoiding, Retractable and Tear-Opening (SMART) Insertion Tool for Cochlear Implantation

Aebischer, Philipp ; Weder, Stefan ; Mantokoudis, Georgios ; Vischer, Mattheus ; Caversaccio, Marco ; Wimmer, Wilhelm

Biomedical Engineering, IEEE Transactions on, 2023, Vol.70, p.860-866

IEEE

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7
Ultrasound Localization of Nitinol Wire of Sub-Wavelength Dimension
Ultrasound Localization of Nitinol Wire of Sub-Wavelength Dimension
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Ultrasound Localization of Nitinol Wire of Sub-Wavelength Dimension

DeVries, D. R ; Olafsen, L. J ; Olafsen, J. S ; Nguyen, H. H ; Schubert, K. E ; Dayawansa, S ; Huang, J. H

Engineering in Medicine and Biology, IEEE Open Journal of, 2022, Vol.3, p.18-24

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8
Analytical Formulas for Micro-Bending and Surface Scattering Loss Estimation in Tube Lattice Fibers
Analytical Formulas for Micro-Bending and Surface Scattering Loss Estimation in Tube Lattice Fibers
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Analytical Formulas for Micro-Bending and Surface Scattering Loss Estimation in Tube Lattice Fibers

Melli, Federico ; Rosa, Lorenzo ; Vincetti, Luca

Lightwave Technology, Journal of, 2023, Vol.41, p.5714-5721

IEEE

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9
Robotic Modules for a Continuum Manipulator With Variable Stiffness Joints
Robotic Modules for a Continuum Manipulator With Variable Stiffness Joints
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Robotic Modules for a Continuum Manipulator With Variable Stiffness Joints

Sozer, Canberk ; Sahu, Sujit Kumar ; Paterno, Linda ; Menciassi, Arianna

Robotics and Automation Letters, IEEE, 2023, Vol.8, p.4745-4752

IEEE

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10
Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs
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Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Tiwary, Nikhilendu ; Ross, Glenn ; Vuorinen, Vesa ; Paulasto-Krockel, Mervi

Electron Devices, IEEE Transactions on, 2023, Vol.70, p.222-229

IEEE

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