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Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Dai, Y. Y ; Anantha, P ; Tan, C. S ; Ntu-Lockheed Martin Joint Lab, Nanyang Technological University, Research Techno Plaza, 50 Nanyang Drive, Singapore 637553 ; Ng, M. Z ; Li, Z. G ; Gan, C. L ; School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 ; Lin, Y. D

Applied Physics Letters, 27 June 2016, Vol.108(26) [Periódico revisado por pares]

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