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Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

Shi, Hongbin ; Che, Faxing ; Ueda, Toshitsugu

Microelectronics Reliability, September 2011, Vol.51(9-11), pp.1850-1855 [Periódico revisado por pares]

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  • Título:
    Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
  • Autor: Shi, Hongbin ; Che, Faxing ; Ueda, Toshitsugu
  • Assuntos: Engineering
  • É parte de: Microelectronics Reliability, September 2011, Vol.51(9-11), pp.1850-1855
  • Descrição: This paper presents the four-point bend test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. The tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/s crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. The test results show that all of them can improve the bend performance significantly; especially the edge bond high module epoxy increased the crosshead displacement, strain and bending force when...
  • Idioma: Inglês

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