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Microstructural evolution of pure copper subjected to friction sliding deformation at room temperature

Deng, S.Q ; Godfrey, A ; Liu, W ; Zhang, C.L

Materials Science & Engineering A, 15 July 2015, Vol.639, pp.448-455 [Periódico revisado por pares]

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  • Título:
    Microstructural evolution of pure copper subjected to friction sliding deformation at room temperature
  • Autor: Deng, S.Q ; Godfrey, A ; Liu, W ; Zhang, C.L
  • Assuntos: Surface Severe Plastic Deformation ; Friction Sliding Deformation ; Ebsd ; Copper ; Deformation Microstructure ; Engineering
  • É parte de: Materials Science & Engineering A, 15 July 2015, Vol.639, pp.448-455
  • Descrição: Samples of commercial oxygen-free high conductivity Cu (99.9% purity) have been deformed at room temperature using a rapid platen friction sliding deformation (PFSD) process, under conditions of high friction and relatively large applied load. The microstructural evolution of the surface layers during PFSD over sliding distances from 7 mm to 242 mm has been characterized and analyzed. The process results in the development of a gradient nanostructure, extending to increasing depths with increasing sliding distance. After a sliding distance of 242 mm the microstructure consists of a 15–20 µm layer of nanoscale lamellae at the top surface, with a sharp transition to a layer consisting of fine deformed grains, with a smooth transition to deformed material below this. Micro-hardness measurements of the nanoscale lamellae and fine deformed grains reveal values of ≈1.85 GPa and 1.2–1.5 GPa, respectively. Analysis of the microstructural evolution suggests that the hardening of the surface layers results in a transfer of shear strain to deeper volumes, enhancing the efficiency of the PFSD process.
  • Idioma: Inglês

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