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Beyond CPO: A Motivation and Approach for Bringing Optics onto the Silicon Interposer

Lee, Benjamin G. ; Nedovic, Nikola ; Greer, Thomas H. ; Gray, C. Thomas

Journal of lightwave technology, 2023-02, Vol.41 (4), p.1-11 [Periódico revisado por pares]

New York: IEEE

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  • Título:
    Beyond CPO: A Motivation and Approach for Bringing Optics onto the Silicon Interposer
  • Autor: Lee, Benjamin G. ; Nedovic, Nikola ; Greer, Thomas H. ; Gray, C. Thomas
  • Assuntos: Bandwidth ; Chip-scale packaging ; Design ; Integrated circuits ; Integrated optics ; Optical amplifiers ; Optical communication ; Optical fiber communication ; Optical switches ; Optics ; Optimization ; Packaging design ; photonic integrated circuits ; photonics ; Silicon ; Stimulated emission ; Thermal environments ; Wiring
  • É parte de: Journal of lightwave technology, 2023-02, Vol.41 (4), p.1-11
  • Descrição: Co-packaged optics (CPO) technology is well positioned to break through the bottlenecks that impede efficient bandwidth scaling in key near-term commercial integrated circuits. We begin by providing some historical context for this important sea change in the optical communications industry. Then, motivated by GPU-based accelerated computing requirements, we investigate the next pain points that are poised to constrain bandwidth and efficiency in future CPO-based systems. We identify 2.5D integrated optics (i.e., bringing optics onto the interposer) as a promising solution that can enable continued scaling for these systems due to the dense wiring available which facilitates more efficient slow-and-wide electrical interfaces. We explore the benefits, challenges, and requirements associated with such tight coupling of the processors and optical engines by considering high-level photonic link design, technology, and packaging. We demonstrate the viability of a control loop which can adequately regulate temperature within the aggressive thermal environment. Then, we introduce a custom simulation framework that allows quantified comparisons of detailed design decisions; the simulations validate the feasibility of the general approach while also providing key guidance to designers on best directions to pursue for efficient optimization.
  • Editor: New York: IEEE
  • Idioma: Inglês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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