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2022 ICCAD CAD Contest Problem B: 3D Placement with D2D Vertical Connections

Hu, Kai-Shun ; Lin, I-Jye ; Huang, Yu-Hui ; Chi, Hao-Yu ; Wu, Yi-Hsuan ; Shen, Chin-Fang Cindy

2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2022, p.1-5

New York, NY, USA: ACM

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Título:
2022 ICCAD CAD Contest Problem B: 3D Placement with D2D Vertical Connections
Autor: Hu, Kai-Shun ; Lin, I-Jye ; Huang, Yu-Hui ; Chi, Hao-Yu ; Wu, Yi-Hsuan ; Shen, Chin-Fang Cindy
Assuntos: 3DIC ; Applied computing ; Applied computing -- Arts and humanities ; Applied computing -- Arts and humanities -- Architecture (buildings) ; Applied computing -- Arts and humanities -- Architecture (buildings) -- Computer-aided design ; Applied computing -- Physical sciences and engineering ; Applied computing -- Physical sciences and engineering -- Engineering ; Applied computing -- Physical sciences and engineering -- Engineering -- Computer-aided design ; Benchmark testing ; Computer architecture ; Costs ; Design automation ; Hardware ; Hardware -- Electronic design automation ; Hardware -- Electronic design automation -- Physical design (EDA) ; Hardware -- Electronic design automation -- Physical design (EDA) -- Placement ; Hardware -- Electronic design automation -- Physical design (EDA) -- Wire routing ; Measurement ; Microprocessors ; Physical design ; placement ; Three-dimensional displays
É parte de: 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 2022, p.1-5
Descrição: In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, and 3) better cost. How to do the netlist partitioning, cell placement in each of the small dies, and also how to determine the location of the D2D inter-connection terminals becomes a new topic. To address this chiplet era physical implementation problem, ICCAD-2022 contest encourages the research in the techniques of multi-die netlist partitioning and placement with D2D vertical connections. We provided (i) a set of benchmarks and (ii) an evaluation metric that facilitate contestants to develop, test, and evaluate their new algorithms.
Editor: New York, NY, USA: ACM
Idioma: Inglês

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2022 ICCAD CAD Contest Problem B: 3D Placement with D2D Vertical Connections

Hu, Kai-Shun ; Lin, I-Jye ; Huang, Yu-Hui ; Chi, Hao-Yu ; Wu, Yi-Hsuan ; Shen, Chin-Fang Cindy

New York, NY, USA: ACM

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