Diffusion bonding of Ni3Al-based alloy using a Ni interlayer

Yang, Z.W. ; Lian, J. ; Wang, J. ; Cai, X.Q. ; Wang, Y. ; Wang, D.P. ; Wang, Z.M. ; Liu, Y.C.

Journal of alloys and compounds, 2020-04, Vol.819, p.153324, Article 153324 [Periódico revisado por pares]

Lausanne: Elsevier B.V

Texto completo disponível