Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints
Du, Yanfeng ; Qiao, Yuanyuan ; Ren, Xiaolei ; Lai, Yanqing ; Zhao, Ning
Electronics (Basel), 2023-04, Vol.12 (8), p.1899 [Periódico revisado por pares]Basel: MDPI AG
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