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Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip

Calderini, G. ; Crescioli, F. ; Dalla Betta, G.-F. ; Gariano, G. ; Gemme, C. ; Guescini, F. ; Hadzic, S. ; Heim, T. ; Lapertosa, A. ; Ravera, S. ; Rummler, A. ; Samy, M.A.A. ; Sultan, D.M.S. ; Vannoli, L. ; Ye, H.

JINST, 2023-01, Vol.18 (1), p.C01010 [Periódico revisado por pares]

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Título:
Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip
Autor: Calderini, G. ; Crescioli, F. ; Dalla Betta, G.-F. ; Gariano, G. ; Gemme, C. ; Guescini, F. ; Hadzic, S. ; Heim, T. ; Lapertosa, A. ; Ravera, S. ; Rummler, A. ; Samy, M.A.A. ; Sultan, D.M.S. ; Vannoli, L. ; Ye, H.
Assuntos: Detector design and construction technologies and materials ; Electrodes ; Hybrid detectors ; Instrumentation and Detectors ; Large Hadron Collider ; Luminosity ; Modules ; Physics ; Pixels ; Radiation-hard detectors ; Smart cards ; Solid state detectors ; Tracking systems
É parte de: JINST, 2023-01, Vol.18 (1), p.C01010
Descrição: Abstract ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × 100 μm 2 (barrel) or 50 × 50 μm 2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm 2 ) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.
Editor: Bristol: IOP Publishing
Idioma: Inglês

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