Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

Yakymovych, A. ; Plevachuk, Yu ; Švec, P. ; Švec, P. ; Janičkovič, D. ; Šebo, P. ; Beronská, N. ; Roshanghias, A. ; Ipser, H.

Journal of electronic materials, 2016-12, Vol.45 (12), p.6143-6149 [Periódico revisado por pares]

New York: Springer US

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